
Testing of Integrated Circuits is important to ensure the production of fault-free chips. However, testing is becoming cumbersome and expensive due to the increasing complexity of these ICs. Technology development has made it possible to produce chips where a complete system, with an enormous transistor count, operating at a high clock frequency, is placed on a single die - SOC (System-on-Chip). The device size miniaturization leads to new fault types, the increasing clock frequencies enforces testing for timing faults, and the increasing transistor count results in a higher number of possible fault sites. Testing must handle all these new challenges in an efficient manner having a global system perspective.
Test design is applied to make a system testable. In a modular core-based environment where blocks of reusable logic, the so called cores, are integrated to a system, test design for each core include: test method selection, test data (stimuli and responses) generation (ATPG), definition of test data storage and partitioning [off-chip as ATE (Automatic Test Equipment) and/or on-chip as BIST (Built-In Self-Test)], wrapper selection and design (IEEE std 1500), TAM (test access mechanism) design, and test scheduling minimizing a cost function whilst considering limitations and constraint. A system test design perspective that takes all the issues above into account is required in order to develop a globally optimized solution.